Electronics Assembly and Reliability Resources
Foresite continually provides the electronics manufacturing industry with up-to-date information on manufacturing reliable electronics assemblies, specializing in reducing contamination risk. Many of our industry contributions can be found here.
Foresite White Paper: Understanding the Effect of Different Heating Cycles
Examine the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Foresite White Paper: A Comparison of Three Ionic Test Methods
This study investigates the strengths and weaknesses of three different methods used to test for ionic contamination.
Foresite Cleanliness Specifications and Limits
Our research sets PCBA cleanliness limits used throughout the industry. Download the specifications.
Foresite Case Study: Finding Residue Sources Using Process Methodology
This case study shows a real-life example of failure analysis in electronics manufacturing. Download the case study.
Foresite White Paper: Comparison of Testing Methods
Explore the pros and cons of five techniques used for residue analysis on electronics assemblies.
Foresite White Paper: Low Voltage, the Incompetent Ignition Source – Dispelling the Myth
Joint research shows microelectronic devices are capable of starting fires.
Foresite Presentation: The Effect of Thermal Profiles on Cleanliness and Electrical Performance
View our presentation about the effects of thermal profile variation on product reliability.
Foresite White Paper: The Critical Parameters of a No-Clean Process
Control these critical parameters to prevent failures related to the no-clean process.
Article and Case Study and Library
Browse archived resources, including Terry Munson’s columns in Circuits Assembly and Circuitnet.
Frequently Asked Questions
Equipment Optimization FAQs
Residue Testing FAQs
Field Failure FAQs
Other Electronics Manufacturing and Reliability Resources
What is a Flux Residue?
Glossary of Residue Testing Terms