Comparison of Testing Methods

The tools used for analysis of residue-related electronics assembly failure analysis are varied.

Each is capable of providing useful data. However, each has certain limitations. In this white paper, we evaluate five techniques for analyzing both visible and invisible residues. 

You will learn about the pros and cons of:

• FTIR (Fourier Transform Infrared Spectroscopy)

• SEM/EDX (Scanning Electron Microscopy/Electron Dispersive X-ray)

• XRF (X-ray Fluorescence)

• Ion Chromatography (Localized, steam extraction/electrical testing)

• ROSE (Product immersion/bulk resistivity testing) 

This free download is helpful if you want to make informed choices about residue analysis on electronics assemblies.