Industry experts at solving reliability and residue problems

Foresite cleanliness limits

Our research sets PCB assembly cleanliness limits used throughout the industry.

 




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The Critical Parameters of a No-Clean Process

No-clean flux technology is widely and successfully used in electronic assembly processes across many industries. But if certain parameters are not effectively controlled in the no-clean process, failures can occur.

 




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Flux applied outside of the contact area escapes the high temperatures necessary to render it benign.
 

 
There are several options for performing selective soldering for plated thru-hole (PTH) components, and each presents a risk of ionic contamination. Primary types of selective… Read more»

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