Industry experts at solving reliability and residue problems

Foresite cleanliness limits

Our research sets PCB assembly cleanliness limits used throughout the industry.

 




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The Critical Parameters of a No-Clean Process

No-clean flux technology is widely and successfully used in electronic assembly processes across many industries. But if certain parameters are not effectively controlled in the no-clean process, failures can occur.

 




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The C3 Corrosivity Index™ is an indicator of the cleanliness of a test site, and is calculated by dividing the maximum current seen during the test by the elapsed time of the test. It provides a single test result value… Read more»

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