Analytical Methods
We'll get to the bottom of your issues. Here are some methods we use.
Commonly Used Residue Analytical Methods
Ion Chromatography
From the beginning, Foresite has used ion chromatography (IC) as a critical tool in our residue-related failure analysis, detecting both anions and cations.
FT-IR Spectroscopy
This analytical method characterizes organic and inorganic substances that could have a negative impact on your product.
Electron Microscopy (SEM/EDS)
Microscopic analysis allows for in-depth analysis of the inner layers of PCBs, PCBAs, and components, catching weaknesses that are almost impossible to pinpoint.
X-ray Fluorescence
XRF is a quick, non-destructive, analytical technique used to determine the elemental composition of a material or mass. Another primary use of XRF, which Foresite performs for numerous clients, is to screen and verify that circuit boards, components and assemblies are compliant to RoHS (Restriction of Hazardous Substances) initiatives.
Learn more about our solutions for reliability problems.
Analytical Methods Used In Standard Investigative Projects
The following table includes some of the testing services Foresite provides. Additional testing can be performed to ASTM, Bellcore, IPC J-STD, JEDEC and customer specifications.
Chemical
Resistivity of Solvent Extract (ROSE)
IPC TM 650 2.3.25D
Ionic Cleanliness Testing of Bare Boards
IPC TM 650 2.3.25.1
Ionic Analysis of Circuit Boards
IPC TM 650 2.3.28B
Halide Content of Soldering Fluxes & Pastes
IPC TM 650 2.3.28.1
Bare Printed Board Cleanliness
IPC TM 650 2.3.28.2
Surface Organic Contamination Detection
IPC TM 650 2.3.38C
Surface Organic Contamination Identification
IPC TM 650 2.3.39C
Environmental
Surface Insulation Resistance, Fluxes
IPC TM 650 2.6.3.3B
Moisture & Insulation Resistance, Conformal Coating
IPC TM 650 2.6.3.4A
Bare Board Cleanliness
IPC TM 650 2.6.3.5
Surface Insulation Resistance, Fluxes – Telecommunications
IPC TM 650 2.6.3.6
Surface Insulation Resistance
IPC TM 650 2.6.3.7
Outgassing, Printed Boards
IPC TM 650 2.6.4B
Resistance to Electrochemical Migration, Solder Mask
IPC TM 650 2.6.14D
Electrochemical Migration Resistance
IPC TM 650 2.6.14.1
Bellcore SIR Test
GR 78 Chapter 13.1
Bellcore Electromigration Test
GR 78 Chapter 13.1
Bellcore Fabricator SIR
Bellcore Chapter 14.4
Mechanical
Adhesion, Tape Testing
IPC TM 650 2.4.1E
Die Shear Strength
IPC TM 650 2.4.42.2
Wire Bond Pull Strength
IPC TM 650 2.4.42.3
Microsectioning
IPC TM 650 2.1.1