Failure analysis investigation is used to determine the root cause of a failure. Electrochemical migration (dendritic growth), corrosion, and electrical leakage problems are typical failure mechanisms found on contaminated surfaces of electronic assemblies (PCBAs). Ion chromatography (IC) is used to identify the specific contaminants and their concentrations. Generally, potential contamination failure mechanisms are identified as increased occurrences of “No Trouble Founds” (NTFs), contact insulation barriers, excessive electrical leakage, surface corrosion, or degradation of the solderability of components or land patterns.
Review the list of industries we serve to see some of the specialized industries Foresite works with, as well as our past clients.
Deliverables for Failure Analysis
In Foresite’s failure analysis package, we provide our client with interpretation of the collected data and a conclusion based on such findings and our experience and knowledge of the effects of contaminants on product reliability. Our conclusions, including recommended corrective/preventive actions, have consistently solved problems for electronics manufacturers.
Requirements for Failure Analysis
In order for Foresite to perform a complete failure analysis of defective product, detailed processing history and environmental information must be provided. All materials and chemistries used in the fabrication of the bare printed circuit board and the subsequent manufacturing sequences, become part of a “process fingerprint.” Details regarding the environment in which the product operates are usually necessary to identify the failure mechanism.