Services > Testing & Analysis
Physical Testing: Shear Testing/Pull Testing
Foresite has developed a process to shear the leads of a surface mount device (i.e. SOIC, SOP, QFP) at the package interface without disturbing the associated solder joint.
Shear/Pull Testing
With our process, the lead can be gripped and subjected to a pull test to assess the strength of the solder joint. With in-house cross-sectioning and visual and SEM imaging capabilities, the resultant fracture can be analyzed (i.e. ductile or brittle fracture, IMC thickness, etc.).
Foresite utilizes a Dage 4000 Bondtester in its shear and pull testing. The Dage 4000 Bondtester is capable of 100 kg of force in the Y-axis (shear) and 10 kg of force in the Z-axis (pull). Foresite has a variety of test cartridges available including 100 g and 5 kg tweezer pull, 10 kg hook pull, and 5 kg and 100 kg shear.
The Nordson DAGE 4000 conforms to, and in many cases exceeds, the following industry standards:
Cold bump pull
JEITA EIAJ ET-7407
BGA bump shear
JEDEC JESD22-B117A
Cold bump pull
JEDEC JESD22-B115
AU ball shear
JEDEC JESD22-B116
Wire pull
DT/NDT MIL STD 883
Ball bond shear
ASTM F1269
Stud pull
MIL STD 883
Flip chip pull
JEDEC JESD22-B109
Die shear
MIL STD 883