The IPC-J-STD-001—or J-Standard as we call it—is the ultimate manufacturing guideline in the electronics industry.

Terry Munson takes us through an in-depth analysis of dendrite growth. Watch from the very beginning as it starts and spreads over a 50 ml gap.

Lead Investigator, Paco Silos, describes the pitfalls of disinfectants used throughout the pandemic and the unintended consequences that continue to plague reliability.

Foresite is now one of the first laboratories in the country with the Keyence EA-300 Laser-based Elemental Analyzer.

When systems fail in the field due to critical PCBA's having and event, dendrite shorting, open solder joints, or even creep corrosion due to sulfur from the environment, it is important to determine root causes.

As kids, we were often challenged to “Spot the Difference” in two side-by-side pictures. At first glance, the images look identical. But of course, there are slight variations.

In the world of electronics, reliability and cleanliness go hand-in-hand. They ensure long-term success.

Terry Munson is the founder and president of Foresite, Inc. He founded Foresite in 1992, then known as CSL (Contamination Studies Laboratories, Inc.).

If you follow industry standards, does that mean you'll have improved reliability? It depends.

The process of coating electronic assemblies has been around for decades. And it would be pretty useful if CMs didn’t keep doing it wrong.

The key to maintaining cleanliness is asking more from your suppliers than you probably currently are. Remember, if you ask for nothing, you will likely get it.

Foresite’s problem-solving technicians take on a new project.

They couldn’t understand it. Their new Immersion Silver Printed Circuit Board Assemblies (PCBAs) were experiencing corrosion, but the electronics company had examined its own materials and methods…

Need to determine whether a solder alloy has the proper concentration of silver? Do you ever want to know whether assemblies are RoHS compliant?

Contaminants remaining on an electronics assembly as a result of the product’s manufacturing process can contribute to unexpected field failures.

Contaminants that find their way into critical performance devices before, during or even after manufacturing can cause serious consequences.

X-ray inspection helps manufacturers identify defects hidden within their printed circuit boards and electronic components.

Cross-sectioning is a common reliability test method used to expose inner details of circuit boards normally hidden to the eye.

Many of our clients know us as a surface residues expert, but our growing lineup of new reliability test methods is an equally important part of our story.

Flux applied outside of the contact area escapes the high temperatures necessary to render it benign.