Resources
Electronics Reliability News and Insights
Quest for Reliability
If you follow industry standards, does that mean you'll have improved reliability? It depends.
Sealing your fate: the pros and cons of different coating material
The process of coating electronic assemblies has been around for decades. And it would be pretty useful if CMs didn’t keep doing it wrong.
Cleanliness: you get what you ask for
The key to maintaining cleanliness is asking more from your suppliers than you probably currently are. Remember, if you ask for nothing, you will likely get it.
Special Projects, Special Attention
Foresite’s problem-solving technicians take on a new project.
Cardboard Contamination Causes Creep Corrosion Conundrum
They couldn’t understand it. Their new Immersion Silver Printed Circuit Board Assemblies (PCBAs) were experiencing corrosion, but the electronics company had examined its own materials and methods…
Total Versatility: X-ray Fluorescence
Need to determine whether a solder alloy has the proper concentration of silver? Do you ever want to know whether assemblies are RoHS compliant?
Clean and mean, the road to reliability
Contaminants remaining on an electronics assembly as a result of the product’s manufacturing process can contribute to unexpected field failures.
Does medical device reliability worry you sick?
Contaminants that find their way into critical performance devices before, during or even after manufacturing can cause serious consequences.
Understanding X-ray
X-ray inspection helps manufacturers identify defects hidden within their printed circuit boards and electronic components.
Understanding cross-sectioning
Cross-sectioning is a common reliability test method used to expose inner details of circuit boards normally hidden to the eye.
Beyond surface residues: new ways to diagnose performance issues
Many of our clients know us as a surface residues expert, but our growing lineup of new reliability test methods is an equally important part of our story.
Staying inside the lines: flux contamination from selective solder process
Flux applied outside of the contact area escapes the high temperatures necessary to render it benign.
Flux entrapment under low-standoff components
Redesigning the ground pad to increase standoff height resolves PCB cleanliness issues in both no-clean and water-soluble flux environments.
What the C3 Corrosivity Index™ Means For Contamination Testing
The C3 Corrosivity Index™ is an indicator of the cleanliness of a test site, and is calculated by dividing the maximum current seen during the test by the elapsed time of the test.
Proper Use of the C3
The C3 was designed and developed as a non-destructive process monitor tool for the electronics industry.
Three Common Sources of Contamination in Electronics Assembly
At Foresite, we experience a great deal of satisfaction when we are able to quickly and expertly identify the root cause and get our customers back on track when they face a difficult and time-sensitive challenge.
Who Dropped The Ball? The Importance of Process Control
We recently investigated a pair of production defects that demonstrated the importance of material identification and process control.
When Good Intentions Go Wrong
We know to be diligent to ensure proper handling of sensitive electronic assemblies. But a recent project provided a sobering reminder of exactly how diligent.
Cleaning to the Rescue!
When electronic assemblies have questionable levels of cleanliness, the end result can vary from no-trouble-found, intermittent performance issues, all the way up to…
Foresite Honored by the Military & Aerospace Electronics 2016 Innovators Awards Program
Kokomo, Indiana, USA – Foresite, Inc., announced today that its UMPIRE®44 was recognized with a Silver award as part of the Military & Aerospace Electronics Innovators Awards program.