If you follow industry standards, does that mean you'll have improved reliability? It depends.

The process of coating electronic assemblies has been around for decades. And it would be pretty useful if CMs didn’t keep doing it wrong.

Contaminants that find their way into critical performance devices before, during or even after manufacturing can cause serious consequences.

Flux applied outside of the contact area escapes the high temperatures necessary to render it benign.

Redesigning the ground pad to increase standoff height resolves PCB cleanliness issues in both no-clean and water-soluble flux environments.

The C3 was designed and developed as a non-destructive process monitor tool for the electronics industry.

When electronic assemblies have questionable levels of cleanliness, the end result can vary from no-trouble-found, intermittent performance issues, all the way up to…