Terry Munson

Curriculum Vitae (CV)

Professional Experience:

1992 - Foresite, Inc. – Kokomo, IN
President and Founder

  • Created a battery of service offerings including failure analysis, process and material qualifications, and cleanliness assessment / validation for the printed circuit board processing industry.

  • Has grown Foresite to support 21 full and part-time employees with annual sales exceeding $5.0 million.

  • Has built a worldwide clientele base of over 2500 companies including Intel, Bayer, NASA and Dell.

  • Consults with a full range of electronics OEMs and subcontractors in industries including medical, automotive, computers, consumer electronics and aerospace.

  • Specifically, for the printed circuit board processing industry:

    • specializes in failure analysis, identifying the root cause(s);

    • identifies any manufacturing process sources of the problem;

    • recommends corrective actions to optimize the process, eliminate the root cause, and evaluate/reclaim non-conforming inventory;

    • qualifies the revised process and establishes process monitoring parameters to avoid future issues.

  • Primary author of the IPC test method for ion chromatography.

  • Developed and patented the C3 tester for localized residue assessment (US patent # 5,783,938 7/98, UK patent # 2324374, China patent # ZL98107079.5, Hong Kong patent # 1018313, Germany patent # 19807580.4).

  • Foresite is ISO 9001:2015 Certified.

1988 - 1992 Delco Electronics (Now Delphi Electronics) – Kokomo, IN
Director, Corrosion Studies Laboratory

  • Developed ion chromatography applications for the electronics and wafer fabrication industries.

  • Was a critical member of a team that eliminated the use of 22 million pounds of CFC materials per year and saved $29 million.

  • Worked as a critical team member of the Q1000 cleanliness supplier specification.

  • Implemented cleanliness standards training courses for all divisions of Delco Electronics.

  • Assessed residue levels and their effect on electronic product performance in all manufacturing areas, including wafer fab, water-soluble hybrids, and engine control modules.

1985-1988 Duke Memorial Hospital – Peru, IN
Lab Technician

  • Worked in autopsy investigations.

  • Supported the hospital wards and emergency room for all analytical lab and blood banking needs.

1980-1984 U.S. Air Force
Military Specialist

  • Worked as a medical lab technician & EMT.

  • Also trained in chemical weapons detection, field operations for disaster recovery and pilot reconnaissance.

Training

1989-Present IPC Trade Association

  • Obtained IPC 610 inspector and instructor certification

  • Attended all advanced ESD courses

  • Participant in solvent replacement manufacturing technology research and educational offerings

1989-1990 Delco Electronics (Now Delphi Electronics)

  • Attended Delco Electronics Engineering courses I, II, and III in statistical analysis

  • Part of FMEA failure analysis research group

1980-1984 U.S. Military – Air Force Reserves and Active Duty

  • Trained and certified as a medical lab technician

  • Trained in chemical weapons detection

  • Trained in field operations for disaster recovery

  • Certified EMT

  • Trained in pilot reconnaissance

Teaching Experience

  • Certified IPC 610 instructor trainer

  • Trained employees and management of client companies in proper cleanliness parameters for electronics manufacturing

  • Hosted the IPC No-Clean Conference in Minneapolis, MN in 1995


Conference Presentations

  • SMTA Pan Pacific Microelectronics Symposium – 2019 – Presentation on “Cleanliness Requirements a Moving Target”

  • SMTA Pan Pacific Microelectronics Symposium – 2018 – Presentation on “Evaluation of No-Clean Flux Residues Remaining After Secondary Process Operations”

  • SMTA Pan Pacific Microelectronics Symposium – 2017 – Presentation on “Comparison of Ionic Test Methods to Determine Their Ability to Reliably Predict Performance Risks”

  • SMTA Pan Pacific Microelectronics Symposium – 2016 – Presentation on “What Makes No-Clean Flux Residue Benign”

  • SMTA Pan Pacific Microelectronics Symposium – 2015 – Presentation on Field Returns of Electronic Hardware – No Trouble Found (NTF) Returns Why”

  • Contributor and frequent presenter at the airline industry PERM (Pb-free Electronics Risk Mitigation) consortium sessions

  • SMTA Harsh Environment conference 2006, 2007 and in 2008 on flux entrapment below low stand off components (QFN in detail)

  • First Tin Whisker Conference at CALCE 2008 on “SAC305 producing whiskers”

  • IPC APEX Conference – 2004 – Poster presentation on “C3 Localized Cleanliness Tester and Localized Extraction Methods for Usage with Ion Chromatography”

  • International Ion Chromatography Symposium (IICS) – 2003 – Poster presentation on “C3 Localized Cleanliness Tester Extraction Techniques”

  • International Ion Chromatography Symposium (IICS) – 2003 – Presentation on “Applying Ion Chromatography in the Electronics Industry”

  • Presented 3 years in a row at the Nepcon International Conference in the mid-nineties

 

Grants & Research Projects

  • 2013 – Missile Defense Agency, DoD (MDA) SBIR Phase I – “Complex Electronic Assembly Cleanliness” – develop ionic cleanliness standards for high performance electronics.

  • 2013 - MDA STTR Phase II – “Development of a Qualification Plan for All Lead-Free Manufacturing Processes for BMDS Interceptor Product Lines”

  • 2012 – ManTech/Y-12 (Oak Ridge, TN) STTR – “Improved Performance of Lead-free Soldered and Plated Circuit Board IC Components Through the Control of Grain Structure as a Means of Tin Whisker Mitigation”

  • 2010 – STTR Phase II on Tin Whisker – “Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devises” Contract # HQ0006-10-C-7204 Agency: Missile Defense Agency (MDA)

  • 2009 – STTR Phase I on Tin Whisker – “Development and Validation of Tin-Whisker Growth Model and Accelerated Testing” Proposal # O083-M04-2001 Agency: OSD/Army topic

  • 2004 – KTC (Kokomo Technology Center) – Helped in the development of a non-profit center for high technology companies to perform industry forwarding research

  • 1999 – 21st Century Funding Grant - Joint undertaking with Rose-Hulman University (Rose-Hulman Ventures) – Project helped to fund the development of the C3 Localized Cleanliness Tester

  • 1998-1999 – Designed Umpire Board Test Vehicle as a substrate by which to qualify electronics manufacturing processes using SIR testing methodologies

  • 1997 – Navy SBIR funding - Studied development of selective conformal coating removal processes

  • 1996 – ARPA Funding - Joint project with Georgia Tech University and U.S. military – Study to prove long term reliability of water-soluble fluxes in military hardware

  • 1996 – EPA Funding - Follow up to Low Residues Solvent Task Force project – CCAMTF study to determine alternative surface finishes for bare boards

  • 1994 – DARPA Funding (division of DOD) – Funding for Low Residues Solvent Task Force: Project enacted to prove that no-clean fluxing technologies could be used for military class 3 hardware specifications

  • 1993 – Army SBIR Funding - Worked on development of Sequential Electrochemical Reduction Analysis (SERA)

  • 1988 – Developed and Authored IPC TM 650-2.3.28 for Identifying and Quantifying Process Residues Utilizing Ion Chromatography

Bibliography of Industry Publications

  • Has published over 150 industry relevant articles since Foresite’s inception

  • 2004 – Circuitnet – wrote monthly column entitled “Residues.com” – some highlighted columns include:

    • October 2004 – “Field Performance Problems”

    • September 2004 – “Failure of a Circuit”

  • 2001 – Cleanliness Symposium – “Correlating Ion Chromatography Results with Electrical Performance Testing”

  • 2000 – Future Circuits International - “The Failure of a Circuit: Reliability Effects of Process Residues”

  • 1996 – Circuits Assembly – wrote monthly column entitled “Process Rx” – some highlighted columns include:

    • Nov 08 thru Feb 09 A four-part article on “Comparative Test Methods looking at process residues”

    • July 2004 – “Is this White Residue a Reliability Risk?”

    • May 2001 – “Incoming Components as a Source of Contamination”

    • June 2001 – “Cleanliness Specifications”

    • March 1997 – “The Crystalline Entity”

    • May 1997 – “Talk About Being Canned”

    • June 1997 – “But I’m Wearing Finger Cots!”

    • February 1997 - “Leakage, Leakage, Leakage”

    • September 1996 – “Garbage In = Garbage Out”

Professional Memberships & Offices Held

  • iNEMI member since 2017 and active member

  • NACE member since 2010 and active member

  • PERM member since 2009 and active member

  • ASTM member since 2006 and active member

  • SMTA member since 2002 and active member

  • Member of Instruments Systems Association (ISA) since 2001

  • Has been a member of the IPC Association Connecting the Electronics Industry since 1988

    • Recent chairman of the Rework Cleaning Task Group for IPC

    • Has held chairman or co-chairman leadership roles in 7 other task groups

    • Is a member of 17 other IPC task groups

Awards

  • 2008 SMT Magazine’s Vision Award for Test Equipment - C3® Critical Cleanliness Control

  • 2003 – Distinguished Committee Service Award for Participation in IPC SIR Round Robin Test Program – Awarded by IPC Association Connecting Electronics Industry

  • 2002 – Distinguished Committee Service Award for Significant Effort in the Release of IPC-TR-583 – Awarded by IPC Association Connecting Electronics Industry

  • 2001 – IPC President’s Award for Contributions to the Advancement of the Electronics Industry

  • 2000 – Distinguished Committee Service Award for Participation in Drafts of Standards and Test Methods – Awarded by IPC Association Connecting Electronics Industry

  • 1998 – US Patent 5,783,938 – Patent awarded for Method and Apparatus for the quantitative measurement of the corrosive effect of residues present on the surface of electronic circuit assemblies

  • 1997 – Indiana Electronics Manufacturing Association’s Certificate of Appreciation for Presentation at the 1997 IEMA Electronics Technology Conference

  • 1996 – EPA Stratospheric Ozone Protection Award to the Low Residues Soldering Task Force in Recognition of Exceptional Contributions to Global Environmental Protection

  • 1996 – Growth 100 Award – Awarded by Indiana University School of Business’s Center for Entrepreneurship and Innovation (CEI)

  • 1995 – Sandia National Laboratory’s President’s Quality Award

  • 1995 – 19th Annual Electronics Manufacturing Seminar – Advancing Technology Award