Electronics Assembly and Reliability Resources

Specifications

Foresite PCB Cleanliness Specifications and Limits

Our research sets PCBA cleanliness limits used throughout the industry. Download the specifications.

White Paper

The Critical Parameters of a No-Clean Process

Control these critical parameters to prevent failures related to the no-clean process. 

White Paper

Evaluation of No-Clean Flux Residues Remaining after Secondary Process Operations

This white paper investigates the effects of no-clean flux residues from secondary soldering and cleaning processes.  

White Paper

Residue Effects of Weak Organic Acid (WOA) Flux Activators

Flux chemistries that are not properly activated or cleaned are the most common sources of detrimental ionic contamination. This white paper compares and contrasts the various flux chemistry types available, and what their potential effects are on long term product reliability.

Presentation

Foresite and BAE presentation from APEX 2007, updated 2014

An exploration of Cleanliness Assessment Correlation to Electronic Hardware Reliability.

White Paper

A Comparison of Three Ionic Test Methods

This study investigates the strengths and weaknesses of three different methods used to test for ionic contamination.  

White Paper

Cleanliness Requirements: A Moving Target

This white paper explores cleanliness requirements for PCBAs and suggests methods to monitor and assess the cleanliness of electronic assemblies.  

White Paper

Comparison of Testing Methods

Explore the pros and cons of five techniques used for residue analysis on electronics assemblies. 

Case Study

Finding Residue Sources Using Process Methodology

This case study shows a real-life example of failure analysis in electronics manufacturing. Download the case study. 

White Paper

Low Voltage, the Incompetent Ignition Source – Dispelling the Myth

Joint research shows microelectronic devices are capable of starting fires.