Industry experts at solving reliability and residue problems

Foresite cleanliness limits

Our research sets PCB assembly cleanliness limits used throughout the industry.

 




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The Critical Parameters of a No-Clean Process

No-clean flux technology is widely and successfully used in electronic assembly processes across many industries. But if certain parameters are not effectively controlled in the no-clean process, failures can occur.

 




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When electronic assemblies have questionable levels of cleanliness, the end result can vary from no-trouble-found, intermittent performance issues, all the way up to hard failure, customer returns. At times, contamination is discovered at ICT or burn-in testing; however, suspect product… Read more»

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