Resources
Surface Contaminate and Residue Photo Gallery
Extensive Corrosion
Corrosion Caused by Water Soluble Flux Trapped Under Part
Solder Bridging
Delamination of Traces
Debris Trapped in Flux
Debris Bridging Capacitors
Corrosion on Failed Assembly in QFP Area
Dendrite Growth
Dendrite Trail
Dendrite Growing Under Connector
Dendrite Growing Under 5v Forced Current
Flux Residue on Surface of Trace in No Clean Process
Extensive Corrosion, Dendrite Growth & Flux Residues not Fully Activated
Dewetting of Pad due to Ionic Residues
Dendrite Growth
Flux Residue Between Leads on QFP
Flux Residue on a Thru Hole Part
Heavy Flux Residue that was Improperly Cleaned
High Degree of Corrosion
Improperly Cured Glue Dot Under Capacitor
Improperly Cured Conformal Coating under UV Light
Debris on Board Behind Leads
Partially Activated Flux After Wave Soldering
Poorly Cured Glue Dot on Board Side
Poor Wetting
Poor Wetting Conditions – No Fillet
Poor Cleaning of Electronic Assembly – Tap Water with No Saponifier was used
Poorly Cured Glue Dot on Bottom of Capacitor
Severe Corrosion
Adhesive Corrosion Causing Metal Attack
Close up view of Copper Sulfate Crystalline Growth
Close up of Dendrites Growing between Component Leads
Corrosion and Visible Debris
Crystalline Copper Sulfate Crystals
Close up of White Residue under BGA Component
Copper Sulfate Crystals Bridging
Corrosion on Component Surface
Crystallized Flux
Dendrite Growing Between Pins on DIP Assembly
Dendrite Growing Between Circuit Traces
Dendrites Growing Between Component Leads
Flux Residue Between Connector Nodes
Dendrite Growth on Board Bottom side
Dendrite Growth on Board Topside
Dendrite Growth on Bare Board
Flux Residues on LCC Underside
Green Residue on Quad D Component
Heavy Corrosion
Residues in Crosshatch Area
SEM / EDX View of Dendrite Growing on Component Lead
Heavy Flux on Underside of LCC Component
Low Angle Adhesive Corrosion
Dendrites in QFP Area
Thermally Overstressed Solder Joint
Solderball on Assembly
Close up view of Thermally Overstressed Solder Joint
Through Hole Leakage with no Visible Residue
Printed Circuit Board with Heavy Thermal Mass
Close up of Gooey Residue from Flux Re-depositing on Board Surface from Vent Stack
Heavy White Residues
White Flux Residues Around Connector Pins
Gooey Residue from Flux Re-depositing on Board Surface from Vent Stack
Corrosion on Connector Edge
Corrosion with Visible Moisture
Press Fit Connector with Residue Plugging Holes
Surface Corrosion on Screw Terminals
Surface Corrosion
Solder Balls Under LCC Component
Processed Board with Darkened Pattern
Thick Gooey Residue Plugging Vias
White Residue Under BGA Component
Zinc Whiskers on Plated Through Hole
White Tin Discoloration