Testing and Analysis Services
Ion Chromatography for Electronic Assemblies and Bare Boards
Tests for contaminants that often contribute to electrochemical failures.
Environmental Testing and Analysis
Determines whether the product’s operational environment may contribute to failure.
Identification of residual species, primarily by ion chromatography analysis.
Identifies ionic and organic residues that may impact product performance, reliability and/or compliance to specifications.
Used to determine the root cause of failures, which is then used to find the source and mitigate the issue.
X-ray Fluorescence Analysis
Provides a meaningful and accurate measure of the RoHS compliancy of a product.
Various industry standard inspections including IPC 610, Acceptability of Electronic Assemblies.
Identifies any product weaknesses or areas for improvement utilizing various, appropriate imaging techniques including SEM/EDS.
Metallurgical analysis allowing in-depth analysis of grain structures, including, for example, the inner layers of chips at up to 1000x magnification.
Characterizes organic and inorganic substances that could have a negative impact on your product.
Physical testing of such product aspects as solder joint strength to quantify improvements or compare methods.
Client Proprietary Research
Research into failure modes that are new to a client, new to a product or process, or new to an application.
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