Metallographic cross-sectioning is used for material characterization or failure mode analysis. Sample preparation requires multiple steps including cutting to near net shape, mounting and encapsulation of the sample. The sample is then rough cut using a range of bonded diamond discs as needed. Polishing begins with 9 micron diamond paste and may progress through 0.05 micron alumina polishing suspension, depending upon requirements. Samples may then be viewed in the as-polished condition or a subsequent etching process can be used to help reveal material microstructure.
Our Analysis Techniques
Foresite uses a variety of techniques to efficiently analyze samples based on the nature of the sample and the analytical objective. Three point fixtures are used at times rather than traditional puck potting, usually resulting in quicker turnaround. Various epoxies are used; for example, a room temperature curing epoxy is used for temperature sensitive samples.
Applications of Cross-Sectioning
Typical applications of cross-sectioning include:
- Component Fractures
- Intermetallic Formation and Thickness
- Solder Thickness
- Bond Line Thickness
- Package Architecture
- Plating Thickness
- Solder Voids
- Solder Grain Structure
- Solder Coverage
- Wetting Conditions