Testing and Analysis Services

 

Ion Chromatography for Electronic Assemblies and Bare Boards

Tests for contaminants that often contribute to electrochemical failures. 

 

Environmental Testing and Analysis

Determines whether the product’s operational environment may contribute to failure. 

 

Residue Characterization

Identification of residual species, primarily by ion chromatography analysis. 

 

Cleanliness Analysis

Identifies ionic and organic residues that may impact product performance, reliability and/or compliance to specifications. 

 

Failure Analysis

Used to determine the root cause of failures, which is then used to find the source and mitigate the issue. 

 

X-ray Fluorescence Analysis

Provides a meaningful and accurate measure of the RoHS compliancy of a product. 

 

IPC Inspection

Various industry standard inspections including IPC 610, Acceptability of Electronic Assemblies. 

 

Microscopy/Imaging/X-ray

Identifies any product weaknesses or areas for improvement utilizing various, appropriate imaging techniques including SEM/EDS. 

 

Cross-Sectioning

Metallurgical analysis allowing in-depth analysis of grain structures, including, for example, the inner layers of chips at up to 1000x magnification. 

 

FTIR Spectroscopy

Characterizes organic and inorganic substances that could have a negative impact on your product. 

 

Physical (Shear/Pull)

Physical testing of such product aspects as solder joint strength to quantify improvements or compare methods. 

 

Client Proprietary Research

Research into failure modes that are new to a client, new to a product or process, or new to an application. 

 

 

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