Solve Your Reliability Problem

To solve your problem, you must first figure out the cause. Foresite identifies and evaluates potential root causes of your problem, including the materials and chemistries used in the fabrication of the bare printed circuit board and the subsequent assembly processes.

 

Electronics Problem Resolution Services and Products

Process Audit

Used to identify deviation from best practices and/or control limits, plus opportunities for improvement.

Process Assessment

Determines if residues from an electronic assembly process are detrimental.  

 

C3 Localized Cleanliness Assessment System

The only tester that indicates whether a specific, critical area of a PCBA is clean. 

Ion Chromatography for Electronic Assemblies and Bare Boards

Tests for contaminants that often contribute to electrochemical failures.

 

Environmental Testing and Analysis

Determines whether the product’s operational environment may contribute to failure.

Residue Characterization

Identification of residual species, primarily by ion chromatography analysis.

 

Failure Analysis

Used to determine the root cause of failures, which can then be used to find the source and mitigate the issue.

X-ray Fluorescence Analysis

Provides a meaningful and accurate measure of the RoHS compliancy of a product.

 

IPC Inspection

Various industry standard inspections, including IPC 610, Acceptability of Electronic Assemblies.

Microscopy/Imaging/X-ray

Utilizes various, appropriate imaging techniques including SEM/EDS.

 

Cross-Sectioning

Metallurigal analysis, allowing in-depth analysis of grain structures – for example, the inner layers of chips – at up to 1000x magnification.

FTIR Spectroscopy

Characterizes organic and inorganic substances that could have a negative impact on your product.

 

Physical (Shear/Pull)

Physical testing of such product features as solder joints.

Electronic Assembly and Component Cleaning

Assess cleanliness level, select/develop cleaning protocol and method, clean and verify.

 

Rescue Cleaning

Used to clean rework soldering fluxes or recover product that has been exposed to contaminants.

Restoration Cleaning

Used to recover product after contamination by a flood, fire or other residue-depositing situation.

 

Evaluation/Inspection

Overall evaluation of electronic product condition, especially related to surface contaminants from manufacturing processes. 

Plasma

Increases the solderability of specified locations while maintaining the integrity of other areas.

 

Conformal Coat Removal

Selective removal of coatings that contribute to failures when they react with ionic contamination.